Rigid busbar
1.Low impedance and good heat dissipation efficiency, reduce the temperature rise of the system 2.Compact structure, ca...
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1.Low impedance and good heat dissipation efficiency, reduce the temperature rise of the system 2.Compact structure, ca...
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1.Low impedance and good heat dissipation efficiency, reduce the temperature rise of the system 2.Compact structure, ca...
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1.Low impedance and good heat dissipation efficiency reduce system temperature rise 2.The structure is compact, which c...
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1.Terminal silver plated ≥5um; Powder coating 0.2-0.4mm, high voltage 1000VDC 2.Powder coating 0.2-0.4mm, high voltage...
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1.Low impedance and good heat dissipation efficiency reduce system temperature rise 2.The structure is compact, which c...
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1.Low impedance and good heat dissipation efficiency reduce system temperature rise 2.The structure is compact, which c...
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1.Low impedance and good heat dissipation efficiency reduce system temperature rise 2.The structure is compact, which c...
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1.Low inductance, can effectively reduce peak voltage and protect electronic components such as IGBT 2.Low impedance an...
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